The Datapath Express7-G3 backplane provides four x8 lane PCI Express 3.0 slots typically intended for hosting input cards, and three x16 lane PCI Express 3.0 slots targeted for hosting output cards.

The Express7-G3 can be used with a standard PICMG 1.3 single-board computer (SBC) as a stand-alone system or in combination with multiple backplanes to provide a PCI Express expansion system for a standard PC.

Connecting Multiple Express7-G3 Backplanes

Star Configuration

The four x8 PCI Express slots in the master chassis (containing the SBC) can be populated with a HLink-G3 card. Each HLink-G3 is then connected to an expansion chassis using an ExCable-G3 and SLink-G3 card. This configuration provides a high number of available PCI Express slots supporting low latency. The Express7-G3 can be used to connect a mixture of multiple Datapath Express7-G3, Express9 and Express9-G3, and Express11-G3 backplanes.

Daisy Chain Configuration

Expansion Link - HLink-G3, ExCable-G3 and SLink-G3

The SLink-G3 card can be used instead of a PICMG 1.3 SBC to configure the Express7-G3 as an expansion backplane from a standard PC or from other Datapath backplanes. The cards are available with Gen.3 compatibility, fully supporting the Datapath Express7-G3 backplane.

Models Options

Product Name/Order Code	Description
Express7-G3	7 slot PCI Express Gen.3 expansion backplane

Express7-G3 Specification

Max Power (without SBC)	25W
Power Requirements	Max current at +3.3V < 0.5A Max current at +12V < 0.5A Max current at +5V < 4A
Form Factor	PICMG1.3 Host SBC interface (x16 PCIe) 3x PCI Express (x16) expansion slots 4x PCI Express (x8) expansion slots
ATX PSU	1 x 24 pin power connectors 8 x 8 pin AUX power connectors
SATA Ports	2 x ports via PICMG1.3 interface
USB Ports	2 x ports via PICMG1.3 interface (USB 2.0)
Operating Temperature	0 to 35°C / 32 to 95°F
Storage Temperature	-20 to 70°C / -4 to 158°F
Relative Humidity	5% to 90% non-condensing

We are continuously developing the technology used within our product ranges delivering outstanding innovative solutions, therefore the specification may change from time to time.